[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Thermal Characterization and Reliability Assessment of Chip Scale Packaged Light-Emitting Diodes with High Color Rendering Index

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