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[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Thermal Characterization and Reliability Assessment of Chip Scale Packaged Light-Emitting Diodes with High Color Rendering Index
Lee, Ju Ho, Ma, Byongjin, Jeon, Soo-Kun, Baek, Seung Ho, Lee, Kwan-HunYear:
2019
DOI:
10.1109/THERMINIC.2019.8923561
File:
PDF, 1.50 MB
2019