Analysis of damage curing in a MOSFET with joule heat...

Microelectronics Reliability 2020 / 01 Vol. 104

Analysis of damage curing in a MOSFET with joule heat generated by forward junction current at the source and drain

Lee, Geon-Beom, Kim, Choong-Ki, Bang, Tewook, Yoo, Min-Soo, Park, Jun-Young, Choi, Yang-Kyu
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
104
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.113548
Date:
January, 2020
File:
PDF, 816 KB
2020
Conversion to is in progress
Conversion to is failed