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Modeling and Controlling Layout Dependent Variations in Semi-Additive Copper Electrochemical Plating
Lang, Christopher I., Boning, Duane S.Volume:
32
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2019.2941439
Date:
November, 2019
File:
PDF, 3.57 MB
2019