[IEEE 2019 International Wafer Level Packaging Conference...

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[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films

Bernhard, Tobias, Zarwell, Sebastian, Steinhauser, Edith, Kempa, Stefan, Bruning, Frank
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Year:
2019
DOI:
10.23919/IWLPC.2019.8914011
File:
PDF, 1.19 MB
2019
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