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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Die Thickness Optimization for Preventing Electro-Thermal Fails Induced by Solder Voids in Power Devices
Vitello, Dario, Albertinetti, Andrea, Rovitto, MarcoYear:
2019
DOI:
10.1109/ECTC.2019.00-34
File:
PDF, 504 KB
2019