[IEEE 2019 IEEE 69th Electronic Components and Technology...

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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - The Analysis for Bump Resistance Improvement by Optimizing the Sputter Condition

Su, Ming-Sin, Wang, Chang-Ning, Tsai, Clair, Yang, T. L., Yang, Rolance, Wu, W. C., Liu, C. S., Chiu, J. M., Chen, Y. F., Pang, Ponder, Ku, Harry, Wang, Kirin, Su, C.H., Hsu, Steven, Lu, Calvin, Liu,
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Year:
2019
DOI:
10.1109/ECTC.2019.00182
File:
PDF, 277 KB
2019
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