[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Improved Structure for Package Substrates with Embedded Thin-Film Capacitor
Akahoshi, Tomoyuki, Mizutani, Daisuke, Fukui, Kei, Yamawaki, Seigo, Fujisaki, Hidehiko, Watanabe, Manabu, Koide, MasateruYear:
2019
DOI:
10.1109/ECTC.2019.00200
File:
PDF, 802 KB
2019