![](/img/cover-not-exists.png)
[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Further Enhancement of Thermal Conductivity through Optimal Uses of h-BN Fillers in Polymer-Based Thermal Interface Material for Power Electronics
Jiang, Han, Zhou, Han, Robertson, Stuart, Zhou, Zhaoxia, Zhao, Liguo, Liu, ChangqingYear:
2019
DOI:
10.1109/ECTC.2019.00241
File:
PDF, 1.66 MB
2019