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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Submicron-Scale Cu RDL Pattering Based on Semi-Additive Process for Heterogeneous Integration
Takano, Takamasa, Kudo, Hiroshi, Tanaka, Masaya, Akazawa, MiyukiYear:
2019
DOI:
10.1109/ectc.2019.00022
File:
PDF, 782 KB
2019