[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Study of BEOL Failure Mode in Flip Chip Packages at High Temperature Conditions
Wang, Wei, Sun, Yangyang, Zhang, Xuefeng, Wang, Lejun, Zhao, Lily, Schwarz, Mark, Stone, Bill, Syed, AhmerYear:
2019
DOI:
10.1109/ectc.2019.00066
File:
PDF, 339 KB
2019