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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Active Through-Silicon Interposer Based 2.5D IC Design, Fabrication, Assembly and Test
Jayabalan, Jayasanker, Chidambaram, Vivek, Siang, Sharon Lim Pei, Xiangyu, Wang, Ming Chinq, Jong, Bhattacharya, SuryaYear:
2019
DOI:
10.1109/ectc.2019.00094
File:
PDF, 843 KB
2019