[IEEE European Workshop Materials for Advanced Metallization. MAM'97 Abstracts Booklet - Villard de Lans, France (1997.03.16-1997.03.19)] European Workshop Materials for Advanced Metallization, - The effect of an additional Ti layer in a sub-/spl mu/m double level Ti/TiN-AlSiCu-TiN metallization for a CMOS-logic-process

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