Improved shape evolution of copper interconnects prepared...

Journal of Applied Electrochemistry 2008 / 11 Vol. 38; Iss. 11

Improved shape evolution of copper interconnects prepared by jet-stream etching

Tsung-Kuang Yeh, Ming-Han Tsai, Mei-Ya Wang, Chen-Kuo Weng
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
38
Language:
english
Pages:
6
DOI:
10.1007/s10800-008-9594-3
Date:
November, 2008
File:
PDF, 313 KB
english, 2008
Conversion to is in progress
Conversion to is failed