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[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - Thermomechanical Characterization of Polymer Thin Films. Application for the Conception and the Manufacturing of a 3D Interposer
Vignoud, Lionel, Assigbe, Nicolas, Morin, Christine, Dechamp, Jerome, Roulet, Lucile, Parry, Guillaume, Estevez, RafaelYear:
2019
DOI:
10.23919/IWLPC.2019.8914090
File:
PDF, 714 KB
2019