Effect of strains on anisotropic material transport in...

Journal of Computational Electronics 2008 / 09 Vol. 7; Iss. 3

Effect of strains on anisotropic material transport in copper interconnect structures under electromigration stress

Roberto Lacerda de Orio, Hajdin Ceric, Siegfried Selberherr
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Volume:
7
Language:
english
Pages:
4
DOI:
10.1007/s10825-008-0211-9
Date:
September, 2008
File:
PDF, 308 KB
english, 2008
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