Fundamental Limits of Organic Packages and Boards and the...

Journal of Electroceramics 2004 / 07-11 Vol. 13; Iss. 1-3

Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging

Rao R. Tummala, P. Markondeya Raj, Steve Atmur, Shubhra Bansal, Sounak Banerji, Fuhan Liu, Swapan Bhattacharya, Venky Sundaram, Ken-ichi Shinotani, George White
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Volume:
13
Language:
english
Pages:
6
DOI:
10.1007/s10832-004-5135-6
Date:
July, 2004
File:
PDF, 279 KB
english, 2004
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