Optimization Methods for Post-Bond Testing of 3D Stacked...

Optimization Methods for Post-Bond Testing of 3D Stacked ICs

Brandon Noia, Krishnendu Chakrabarty, Erik Jan Marinissen
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Volume:
28
Language:
english
Pages:
18
DOI:
10.1007/s10836-011-5233-8
Date:
February, 2012
File:
PDF, 1.05 MB
english, 2012
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