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Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range
W. H. Zhu, Sharry Ang, S. L. GanVolume:
40
Language:
english
Pages:
5
DOI:
10.1007/s10853-005-0598-7
Date:
March, 2005
File:
PDF, 483 KB
english, 2005