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Sequential deposition of copper/alumina composites
X. Wang, J. Ma, A. Maximenko, E. A. Olevsky, M. B. Stern, B. M. GueninVolume:
40
Language:
english
Pages:
3
DOI:
10.1007/s10853-005-3869-4
Date:
September, 2005
File:
PDF, 629 KB
english, 2005