Effect of the thickness of Bi–Te compound and Cu electrode on the resultant Seebeck coefficient in touching Cu/Bi–Te/Cu composites
Osamu Yamashita, Hirotaka OdaharaVolume:
42
Language:
english
Pages:
11
DOI:
10.1007/s10853-006-0600-z
Date:
July, 2007
File:
PDF, 619 KB
english, 2007