Reliability of Hermetic RF MEMS Wafer Level Packaging Using...

Key Engineering Materials 2006 / 12 Vol. 326-328

Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding

Wang, Qian, Choa, Sung Hoon, Kim, Woon Bae, Hwang, Jun Sik, Ham, Suk Jin, Moon, Chang Youl
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Volume:
326-328
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.326-328.609
Date:
December, 2006
File:
PDF, 447 KB
2006
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