Impact of Subsurface Damage on SiC Wafer Shape

Materials Science Forum 2019 / 7 Vol. 963

Impact of Subsurface Damage on SiC Wafer Shape

Moeggenborg, Kevin, Manning, Ian, Searson, Jon, Chung, Gil Yong
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Volume:
963
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/msf.963.530
Date:
July, 2019
File:
PDF, 662 KB
2019
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