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Dynamic wetting and heat transfer at the initiation of aluminum solidification on copper substrates
Dominique Bouchard, Sébastien Leboeuf, Jean-Paul Nadeau, Roderick I. L. Guthrie, Mihaiela IsacVolume:
44
Language:
english
Pages:
11
DOI:
10.1007/s10853-008-2888-3
Date:
April, 2009
File:
PDF, 500 KB
english, 2009