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Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing
M. Drozdov, G. Gur, Z. Atzmon, W. D. KaplanVolume:
43
Language:
english
Pages:
11
DOI:
10.1007/s10853-008-2955-9
Date:
September, 2008
File:
PDF, 623 KB
english, 2008