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Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints
Hongwen He, Guangchen Xu, Fu GuoVolume:
45
Language:
english
Pages:
7
DOI:
10.1007/s10853-009-4022-6
Date:
February, 2010
File:
PDF, 512 KB
english, 2010