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Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization
Joydeep Maity, Tapan Kumar Pal, Rabindranath MaitiVolume:
45
Language:
english
Pages:
13
DOI:
10.1007/s10853-010-4402-y
Date:
July, 2010
File:
PDF, 1.02 MB
english, 2010