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Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging
Christopher Fuchs, Timo Schreck, Michael KaloudisVolume:
47
Language:
english
Pages:
6
DOI:
10.1007/s10853-012-6257-x
Date:
May, 2012
File:
PDF, 527 KB
english, 2012