Microstructural damage analysis of SnAgCu solder joints and...

Journal of Materials Science: Materials in Electronics 2005 / 10 Vol. 16; Iss. 10

Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures

M. Erinç, P. J. G. Schreurs, G. Q. Zhang, M. G. D. Geers
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
16
Language:
english
Pages:
8
DOI:
10.1007/s10854-005-3748-4
Date:
October, 2005
File:
PDF, 1.06 MB
english, 2005
Conversion to is in progress
Conversion to is failed