Effect of Ag content on the microstructure development of...

Journal of Materials Science: Materials in Electronics 2006 / 03 Vol. 17; Iss. 3

Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects

Henry Y. Lu, Haluk Balkan, K. Y. Simon Ng
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Volume:
17
Language:
english
Pages:
8
DOI:
10.1007/s10854-006-6758-y
Date:
March, 2006
File:
PDF, 1.46 MB
english, 2006
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