Electromigration statistics and damage evolution for...

Journal of Materials Science: Materials in Electronics 2007 / 03 Vol. 18; Iss. 1-3

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Huang-Lin Chao, Paul S. Ho, Min Ding, Peng Su, Trent Uehling, Lakshmi N. Ramanathan
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
18
Language:
english
Pages:
12
DOI:
10.1007/s10854-006-9026-2
Date:
March, 2007
File:
PDF, 611 KB
english, 2007
Conversion to is in progress
Conversion to is failed