Effect of underfill on bending fatigue behavior of chip...

Journal of Materials Science: Materials in Electronics 2008 / 05 Vol. 19; Iss. 5

Effect of underfill on bending fatigue behavior of chip scale package

Bo-In Noh, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung
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Volume:
19
Language:
english
Pages:
5
DOI:
10.1007/s10854-007-9354-x
Date:
May, 2008
File:
PDF, 334 KB
english, 2008
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