![](/img/cover-not-exists.png)
Full-Time Junction Temperature Extraction of IGCT Based on Electro-thermal Model and TSEP Method for High-Power Applications
Xu, Chaoqun, Zhao, Biao, Zhang, Xiangyu, Chen, Zhengyu, Liu, Jiapeng, Zhou, Wenpeng, Yu, Zhanqing, Zeng, RongYear:
2020
Journal:
IEEE Transactions on Industrial Electronics
DOI:
10.1109/TIE.2019.2962423
File:
PDF, 2.62 MB
2020