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Effect of the soldering time on the formation of interfacial structure between Sn–Ag–Zn lead-free solder and Cu substrate
Jing Bo Wan, Yong Chang Liu, Chen Wei, Peng Jiang, Zhi Ming GaoVolume:
19
Language:
english
Pages:
9
DOI:
10.1007/s10854-007-9505-0
Date:
December, 2008
File:
PDF, 919 KB
english, 2008