Stability of AuSn eutectic solder cap on Au socket during reflow
D. Q. Yu, H. Oppermann, J. Kleff, M. HutterVolume:
20
Language:
english
Pages:
5
DOI:
10.1007/s10854-008-9606-4
Date:
January, 2009
File:
PDF, 313 KB
english, 2009