Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications
V. N. Sekhar, T. C. Chai, S. Balakumar, Lu Shen, S. K. Sinha, A. A. O. Tay, Seung Wook YoonVolume:
20
Language:
english
Pages:
13
DOI:
10.1007/s10854-008-9610-8
Date:
January, 2009
File:
PDF, 815 KB
english, 2009