A comparison of impression, indentation and...

Journal of Materials Science: Materials in Electronics 2009 / 04 Vol. 20; Iss. 4

A comparison of impression, indentation and impression-relaxation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders at room temperature

R. Mahmudi, A. R. Geranmayeh, H. Noori, H. Khanbareh, N. Jahangiri
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Volume:
20
Language:
english
Pages:
7
DOI:
10.1007/s10854-008-9726-x
Date:
April, 2009
File:
PDF, 527 KB
english, 2009
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