Fluxless bonding of silicon wafers to molybdenum substrates using electroplated tin-rich solder
Pin J. Wang, Jong S. Kim, Dongwook Kim, Chin C. LeeVolume:
20
Language:
english
Pages:
9
DOI:
10.1007/s10854-008-9731-0
Date:
April, 2009
File:
PDF, 467 KB
english, 2009