Adhesion characteristics of Cu/Ni–Cr/polyimide flexible...

Journal of Materials Science: Materials in Electronics 2009 / 09 Vol. 20; Iss. 9

Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung
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Volume:
20
Language:
english
Pages:
6
DOI:
10.1007/s10854-008-9811-1
Date:
September, 2009
File:
PDF, 478 KB
english, 2009
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