Effect of geometry and dielectric material on thermo-mechanical strain on micro-vias in build-up substrates
Kimihiro Yamanaka, Teruya Fujisaki, Manabu Ichinose, Takafumi OoyoshiVolume:
21
Language:
english
Pages:
7
DOI:
10.1007/s10854-009-0022-1
Date:
September, 2010
File:
PDF, 718 KB
english, 2010