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Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes
Shihua Yang, Yanhong Tian, Chunqing WangVolume:
21
Language:
english
Pages:
7
DOI:
10.1007/s10854-009-0042-x
Date:
November, 2010
File:
PDF, 1020 KB
english, 2010