Temperature measurement at flip chip solder joint during...

Journal of Materials Science: Materials in Electronics 2010 / 01 Vol. 21; Iss. 1

Temperature measurement at flip chip solder joint during electromigration test

Kimihiro Yamanaka, Takafumi Ooyoshi, Takayuki Nejime
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
21
Language:
english
Pages:
5
DOI:
10.1007/s10854-009-9868-5
Date:
January, 2010
File:
PDF, 357 KB
english, 2010
Conversion to is in progress
Conversion to is failed