Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu...

Journal of Materials Science: Materials in Electronics 2010 / 08 Vol. 21; Iss. 8

Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu soldered joints with aging treatment

Wen-Xue Chen, Song-Bai Xue, Hui Wang, Yu-Hua Hu
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Volume:
21
Language:
english
Pages:
8
DOI:
10.1007/s10854-009-9993-1
Date:
August, 2010
File:
PDF, 1.02 MB
english, 2010
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