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Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate
Changfei Peng, Jun Shen, Weidong Xie, Jie Chen, Cuiping Wu, Xiaochuan WangVolume:
22
Language:
english
Pages:
10
DOI:
10.1007/s10854-010-0214-8
Date:
July, 2011
File:
PDF, 1.46 MB
english, 2011