Intermetallic reactions in a Sn-3.5Ag-1.5In solder...

Journal of Materials Science: Materials in Electronics 2011 / 11 Vol. 22; Iss. 11

Intermetallic reactions in a Sn-3.5Ag-1.5In solder ball-grid-array package with Au/Ni/Cu pads

Jie Chen, Jun Shen, Weidong Xie, Hui Liu
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Volume:
22
Language:
english
Pages:
6
DOI:
10.1007/s10854-011-0349-2
Date:
November, 2011
File:
PDF, 1.74 MB
english, 2011
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