Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test
Yanhong Tian, Wei Liu, Rong An, Wei Zhang, Lina Niu, Chunqing WangVolume:
23
Language:
english
Pages:
12
DOI:
10.1007/s10854-011-0538-z
Date:
January, 2012
File:
PDF, 2.99 MB
english, 2012