[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Construction and Verification of Novel Insulation Defect Location System with High Space Resolution for Next Generation Power Module
Maki, Junya, Matsuzoe, Takakazu, Kozako, Masahiro, Hikita, Masayuki, Nakamura, Yoko, Taniguchi, Katsumi, Ikeda, Yoshinari, Okamoto, KenjiYear:
2019
DOI:
10.23919/ICEP.2019.8733578
File:
PDF, 2.24 MB
2019