Moisture resistance evaluation on single electronic package moulding compound
Tan, Cher Ming, Narula, Udit, Seow, Guan Ling, Sangwan, Vivek, Chen, Ching Hsiang, Lin, Shu Ping, Chen, Jia YuanYear:
2020
Journal:
Journal of Materials Chemistry C
DOI:
10.1039/c9tc04298a
File:
PDF, 2.96 MB
2020