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Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints
Zhang, Xudong, Hu, Xiaowu, Jiang, Xiongxin, Zhou, Liuru, Li, QinglinJournal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-02764-1
Date:
December, 2019
File:
PDF, 4.97 MB
2019