Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between...

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Journal of Electronic Materials 2020 / 1

Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging

Tian, Feifei, Pang, Xueyong, Xu, Bo, Liu, Zhi-Quan
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Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07909-w
Date:
January, 2020
File:
PDF, 1.83 MB
2020
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