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In situ Disbond Detection in Adhesive Bonded Multi-layer Metallic Joint Using Time-of-Flight Variation of Guided Wave

Liu, Menglong, Chen, Shuting, Zheng Wong, Zheng, Yao, Kui, Cui, Fangsen
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Journal:
Ultrasonics
DOI:
10.1016/j.ultras.2020.106062
Date:
January, 2020
File:
PDF, 3.79 MB
2020
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